이번에는 비아가 애플을 공격!

"VIA Sues Apple for Patent Infringement"

얼마 전 S3 Graphics와 Apple이 격돌하여 싸우더니 이번에는 모회사인 VIA까지 거들고 있습니다.

S3/HTC가 텍스쳐 압축 기술인 S3TC 관련 특허를 두고 제소한 반면 비아는 마이크로프로세서 관련특허를 침해했다고 하네요.

침해당했다고 주장하는 세 가지 특허는 아래와 같습니다.

US Patent No. 6253312, Method and apparatus for double operand load,
US Patent Nos. 6253311 & 6754810, Instruction set for bi-directional conversion and transfer of integer and floating point data.

1999년 비아가 IDT,Cyrix,Centaur 등의 마이크로프로세서를 인수한 이후로 x86관련 CPU를 제조했는데 이 부분이 문제가 되는듯.

애플의 아이패드, 아이폰, 아이팟, 애플TV와 관련 소프트웨어가 해당이 된다고 합니다.

S3/HTC/VIA에 3연타를 맞은 애플. 과연 어떻게 반응할지, 그리고 ITC의 판결결과가 어떻게 나올지 기대되는 부분입니다.

관련링크 : http://www.via.com.tw/en/resources/pressroom/pressrelease.jsp?press_release_no=5787 

VIA Sues Apple for Patent Infringement

Complaint covers three patents infringed by Apple products

Taipei, Taiwan, 22 September, 2011 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced it has taken legal action against Apple Inc., filing a complaint with the United States International Trade Commission (ITC) and the US District Court of Delaware for patent infringement by Apple’s iPhone, iPad, iPod, Apple TV product lines, and associated software.

"VIA has built up an extensive IP portfolio consisting of over 5,000 patents as a result of significant investments in world class technology research and development," commented Wenchi Chen, CEO, VIA Technologies, Inc. "We are determined to protect our interests and the interests of our stockholders when our patents are infringed upon."

The patents at issue cover microprocessor functionality featured in Apple iPhone, iPad, iPod, and Apple TV devices, namely:

• US Patent No. 6253312, Method and apparatus for double operand load,
• US Patent Nos. 6253311 & 6754810, Instruction set for bi-directional conversion and transfer of integer and floating point data.

About VIA Technologies, Inc.

VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw